Brillink Inc., founded in the third quarter of 2025 with financial support from Artilux, a leading manufacturer of germanium silicon photonics (GeSi Photonics), and Alchip, an ASIC and Chiplet design service provider in the AI computing field, today announced its advanced 2D array vertical coupling technology with low loss and high bandwidth density. technology) as the core to create a new generation photonic interconnection platform.
Co-Packaged Optics Technology is expected to launch two innovative technology solutions for the two major application scenarios of short-distance vertical expansion (scale-up) and long-distance horizontal expansion (scale-out) of CPO (Co-Packaged Optics) architecture in AI data centers, including Micro-LED array high-speed optical communication modules, and photonic integrated circuit (PIC) optical coupling platform with CW Laser and high-speed optical waveguide modulator. Both solutions have the characteristics of high bandwidth, low power consumption and large-scale mass production, meeting the rapid growth demand for data transmission in high-speed computing in the AI era. Technical verification has been initially completed and the first product will be completed and officially launched in the third quarter of 2026.
Optics Technology stated that according to industry research reports, the global silicon photonics market is rapidly expanding at an average annual compound growth rate of nearly 30%. The market size is expected to grow from US$2.65 billion in 2025 to US$9.65 billion in 2030. This wave of growth is mainly driven by the strong demand for high-speed data transmission in fields such as AI, cloud computing, and quantum technology. In view of this, Photonics Technology has built a photonic interconnect platform based on its advanced 2D array surface-emitting optical coupling technology with low loss and high bandwidth density as the core. It has established a complete platform covering the PDK/ADK design process, high-speed optoelectronic component optical coupling architecture and advanced packaging integration to reduce costs and improve mass production. It also continues to accumulate Taiwan's silicon photonics upstream and Micro-LED The key IP for high-speed transmission forms a core asset and technology moat for sustainable expansion, striving to build Taiwan's global competitive advantage in the high-speed optical communications and silicon photonics industries.
In addition, Optical Xun Technology also announced the appointment of Dr. Fang Yanxiang, who has served at the Industrial Technology Research Institute for 16 years, as chief operating officer (COO). Fang Yanxiang was the leader of the Electro-Optical Systems Department of ITRI, where he led a number of Micro-LED and silicon photonics projects. He has extensive experience in optoelectronic component design and the promotion of the industrial ecosystem. He will lead a senior team composed of elites in the optoelectronics industry to carry out comprehensive layout for the two main application markets of AI accelerators, vertical expansion (scale-up) and horizontal expansion (scale-out).
Fang Yanxiang said that AI data centers are promoting a comprehensive upgrade of global computing and data transmission. Therefore, Optical Xun Technology will focus on integration solutions based on advanced 2-dimensional array surface-emitting optical coupling technology to help data centers maintain efficient operations when facing massive data and computing challenges. In addition, we are pleased to receive the recognition and support of Optic Technology Research and Innovation, Shixin Electronics and other industry partners. This move will accelerate Optic Xun Technology’s commercialization process from design verification to mass production introduction, and accelerate the current CPO Progress in optical coupling mass production has promoted the application of next-generation CPO optical communications, and has achieved a key position in the AI generation optoelectronic integration market.